Release material "Sepanium" for printed circuit board manufacturing process.
Heat-resistant and gas barrier excellent release aluminum foil for printed circuit board manufacturing processes! An eco-friendly product that can also be recycled!
This is a release material that has a release film applied to an aluminum foil, which is currently used as a release material in the printed circuit board lamination process! It is available in both roll and sheet formats.
- Company:東洋アルミニウム
- Price:Other